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July 15 2017

What is BGA

A ball grid array (BGA) is a type of surface-mount packaging (a chip carrier) used for integrated circuits. BGA packages are used to permanently mount devices such as microprocessors. A BGA can provide more interc... pins than can be put on a dual in-line or flat package. The whole bottom surface of the device can be used, instead of just the perimeter. The leads are also on average shorter than with a perimeter-only type, leading to better performance at high speeds. Soldering of BGA devices requires precise control and is usually done by automated processes. BGA devices are not suitable for socket mounting, normal distribution of letters, as opposed to using 'Content here, content here', making it look like readable English.

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July 12 2017

Calibrating the Home button in iPhone, iPad and iPod touch

Category: iphone, thechnology

Over time, most owners of iOS-devices can have a small, but rather unpleasant problem with the Home button, which starts responding to the presses through time. Usually this does not happen immediately, but after about 1.5-2 years from the date of purchase.pins than can be put on a dual in-line or flat package. The whole bottom surface of the device can be used, instead of just the perimeter. The leads are also on average shorter than with a perimeter-only type, leading to better performance at high speeds. Soldering of BGA devices requires precise control and is usually done by automated processes. BGA devices are not suitable for socket mounting.normal distribution of letters, as opposed to using 'Content here, content here', making it look like readable English.

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July 11 2017

Replace videochip

Category: BGA, thechnology, replace

Over time, most owners of iOS-devices can have a small, but rather unpleasant problem with the Home button, which starts responding to the presses through time. Usually this does not happen immediately, but after about 1.5-2 years from the date of purchase.pins than can be put on a dual in-line or flat package. The whole bottom surface of the device can be used, instead of just the perimeter. The leads are also on average shorter than with a perimeter-only type, leading to better performance at high speeds. Soldering of BGA devices requires precise control and is usually done by automated processes. BGA devices are not suitable for socket mounting.normal distribution of letters, as opposed to using 'Content here, content here', making it look like readable English.

Posted by admin
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